Demonstration of concept to bring the endcap to life using Intel embedded technology.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.